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Cure Cycle Optimization of Compression Molding Process of Silicaphenolic Composite Laminates By Mathematical Modelling And Simulation


This paper was presented at the 2007 NAFEMS World Congress held in Vancouver, Canada.

Document Details

ReferenceNWC07_35
AuthorUsha. K
LanguageEnglish
TypePaper
Date 22nd May 2007
OrganisationIndian Space Research Organisation

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